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(R) VND600SP DOUBLE CHANNEL HIGH SIDE SOLID STATE RELAY TYPE VND600SP s s RDS(on) 30m Ilim 25A VCC 36 V DC SHORT CIRCUIT CURRENT: 25 A 10 CMOS COMPATIBLE INPUTS s PROPORTIONAL LOAD CURRENT SENSE s UNDERVOLTAGE AND OVERVOLTAGEn SHUT-DOWN s OVERVOLTAGE CLAMP s THERMAL SHUT DOWN s CURRENT LIMITATION s VERY LOW STAND-BY POWER DISSIPATION s PROTECTION AGAINST: n LOSS OF GROUND AND LOSS OF VCC s REVERSE BATTERY PROTECTION (*) DESCRIPTION The VND600SP is a monolithic device made using STMicroelectronics VIPower M0-3 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 BLOCK DIAGRAM 1 PowerSO-10TM ORDER CODES PACKAGE PowerSO-10TM TUBE T&R VND600SP VND600SP13TR transient compatibility table). This device has two channels in high side configuration; each channel has an analog sense output on which the sensing current is proportional (according to a known ratio) to the corresponding load current. Built-in thermal shut-down and outputs current limitation protect the chip from over temperature and short circuit. Device turns off in case of ground pin disconnection. VCC OVERVOLTAGE VCC CLAMP UNDERVOLTAGE PwCLAMP 1 DRIVER 1 INPUT 1 LOGIC INPUT 2 GND DRIVER 2 ILIM1 Vdslim1 IOUT1 K Ot1 OUTPUT 1 CURRENT SENSE 1 OUTPUT 2 Ot2 PwCLAMP 2 Ot1 ILIM2 Vdslim2 IOUT2 OVERTEMP. 1 OVERTEMP. 2 Ot2 K CURRENT SENSE 2 (*) See application schematic at page 8 Rev. 2 1/18 July 2004 1 VND600SP ABSOLUTE MAXIMUM RATING Symbol VCC -VCC - IGND IOUT IR IIN VCSENSE Parameter DC supply voltage Reverse supply voltage DC reverse ground pin current Output current Reverse output current Input current Current sense maximum voltage Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) - INPUT VESD - CURRENT SENSE - OUTPUT - VCC Maximum Switching Energy (L=0.13mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=40A) Power dissipation at Tc=25C Junction operating temperature Case operating temperature Storage temperature 4000 2000 5000 5000 145 96.1 Internally limited -40 to 150 -55 to 150 V V V V mJ W C C C Value 41 -0.3 -200 Internally limited -21 +/- 10 -3 +15 Unit V V mA A A mA V V EMAX Ptot Tj Tc TSTG CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C. PINS GROUND INPUT 2 INPUT 1 C.SENSE1 C.SENSE2 6 7 8 9 10 11 VCC 5 4 3 2 1 OUTPUT 2 OUTPUT 2 N.C. OUTPUT 1 OUTPUT 1 Connection / Pin Floating To Ground Current Sense Through 1K resistor N.C. X X Output X Input X Through 10K resistor CURRENT AND VOLTAGE CONVENTIONS IS VCC IIN1 INPUT1 VIN1 CURRENT SENSE 1 IIN2 VIN2 INPUT2 IOUT2 OUTPUT2 IOUT1 OUTPUT1 ISENSE1 VSENSE1 VOUT1 VF1 (*) VCC VOUT2 ISENSE2 VSENSE2 CURRENT SENSE 2 GROUND IGND (*) VFn = VCCn - VOUTn during reverse battery condition 2/18 1 VND600SP THERMAL DATA Symbol Rthj-case Rthj-amb (1) (2) Parameter Thermal resistance junction-case Thermal resistance junction-ambient (MAX) (MAX) Value 1.3 51.3 (1) 37 (2) Unit C/W C/W When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick). When mounted on a standard single-sided FR-4 board with 6 cm 2 of Cu (at least 35m thick). ELECTRICAL CHARACTERISTICS (8V IOUT=5A; Tj=25C IOUT=5A; Tj=150C IOUT=3A; VCC=6V ICC=20mA (see note 1) Off State; VCC=13V; VIN=VOUT =0V IS (**) Supply current Off State; VCC=13V; VIN=VOUT =0V; Tj=25C On state; VIN=5V; VCC=13V; IOUT=0A; RSENSE=3.9k VIN=VOUT=0V VIN=0V; VOUT=3.5V VIN=VOUT=0V; VCC=13V; Tj =125C VIN=VOUT=0V; VCC=13V; Tj =25C 0 -75 IL(off1) IL(off2) IL(off3) IL(off4) (**) Per device. Off Off Off Off State State State State Output Current Output Current Output Current Output Current PROTECTIONS (see note 1) Symbol Ilim TTSD TR THYST Vdemag VON Parameter DC short circuit current Thermal shut-down temperature Thermal reset temperature Thermal hysteresis Turn-off output voltage clamp Output voltage drop limitation IOUT =2A; VIN=0V; L=6mH IOUT =0.5A Tj= -40C...+150C VCC=13V 5.5V VCC-41 VCC-48 VCC-55 50 Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. VCC - OUTPUT DIODE Symbol VF Parameter Forward on Voltage Test Conditions -IOUT =2.6A; Tj=150C Min Typ Max 0.6 Unit V 3/18 1 VND600SP ELECTRICAL CHARACTERISTICS (continued) CURRENT SENSE (9VVCC16V) (See figure 1) Symbol K1 dK1/K1 K2 dK2/K2 K3 dK3/K3 VSENSE1,2 Parameter IOUT /ISENSE Current Sense Ratio Drift Test Conditions IOUT1 or IOUT2=0.5A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=0.5A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=5A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C Current Sense Ratio Drift IOUT1 or IOUT2=5A; VSENSE=4V; other channels open; Tj=-40C...150C IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C Current Sense Ratio Drift Max analog sense IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C...150C VCC=5.5V; IOUT1,2=2.5A; RSENSE=10k VCC>8V, IOUT1,2=5A; RSENSE=10k VCC=13V; RSENSE=3.9k Min 3300 -10 Typ 4400 Max 6000 +10 % Unit IOUT /ISENSE 4200 4400 -6 4900 4900 6000 5750 +6 % IOUT /ISENSE 4200 4400 -6 2 4 4900 4900 5500 5250 +6 % V V output voltage Analog sense output VSENSEH voltage in overtemperature condition Analog Sense Output RVSENSEH Impedance in Overtemperature Condition Current sense delay tDSENSE response 5.5 V VCC=13V; Tj>TTSD; All channels open to 90% ISENSE (see note 2) 400 500 s LOGIC INPUT (Channels 1,2) Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input low level voltage Low level input current Input high level voltage High level input current Input hysteresis voltage Input clamp voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V SWITCHING (V CC=13V) Symbol td(on) td(off) Parameter Turn-on delay time Turn-on delay time Test Conditions RL=2.6 (see figure 1) RL=2.6 (see figure 1) RL=2.6 (see figure 1) Min Typ 30 30 See relative diagram See relative diagram Max Unit s s V/s (dVOUT/dt)on Turn-on voltage slope (dVOUT/dt)off Turn-off voltage slope RL=2.6 (see figure 1) V/s Note 1: V clamp and VOV are correlated. Typical difference is 5V. Note 2: current sense signal delay after positive input slope. 4/18 2 VND600SP TRUTH TABLE (per channel) CONDITIONS Normal operation Overtemperature Undervoltage Overvoltage INPUT L H L H L H L H L H H L H L OUTPUT L H L L L L L L L L L H H L SENSE 0 Nominal 0 VSENSEH 0 0 0 0 0 (Tj Short circuit to GND Short circuit to VCC Negative output voltage clamp 5/18 VND600SP ELECTRICAL TRANSIENT REQUIREMENTS ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E I -25 V +25 V -25 V +25 V -4 V +26.5 V II -50 V +50 V -50 V +50 V -5 V +46.5 V TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E IV -100 V +100 V -150 V +100 V -7 V +86.5 V Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2 I C C C C C C IV C C C C C E CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Figure 1: Switching Characteristics (Resistive load R L=2.6) VOUT 80% dVOUT/dt(on) tr ISENSE 90% 10% 90% dVOUT/dt(off) tf t INPUT tDSENSE t td(off) td(on) t 6/18 VND600SP Figure 2: Waveforms NORMAL OPERATION INPUTn LOAD CURRENTn SENSEn UNDERVOLTAGE VCC INPUTn LOAD CURRENTn SENSEn OVERVOLTAGE VOV VUSD VUSDhyst VCC INPUTn LOAD CURRENTn SENSEn VCC < VOV VCC > VOV SHORT TO GROUND INPUTn LOAD CURRENTn LOAD VOLTAGEn SENSEn SHORT TO VCC INPUTn LOAD VOLTAGEn LOAD CURRENTn SENSEn ISENSE= VSENSEH RSENSE TTSD TR 7/18 VND600SP APPLICATION SCHEMATIC +5V Rprot INPUT1 VCC Dld C Rprot Rprot CURRENT SENSE1 INPUT2 OUTPUT1 Rprot CURRENT SENSE2 GND OUTPUT2 RSENSE1 RSENSE2 VGND RGND DGND GND PROTECTION REVERSE BATTERY NETWORK AGAINST Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / IS(on)max. 2) RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device's datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input thresholds and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected. LOAD DUMP PROTECTION Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table. 8/18 1 VND600SP C I/Os PROTECTION: If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. Figure 3: IOUT/ISENSE versus IOUT IOUT /ISENSE -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k. 6500 6000 max.Tj=-40C 5500 max.Tj=25...150C 5000 4500 4000 3500 3000 min.Tj=25...150C typical value min.Tj=-40C 0 2 4 6 8 IOUT (A) 10 12 14 16 9/18 1 VND600SP Off State Output Current IL(off1) (uA) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 High Level Input Current Iih (uA) 5 4.5 Off state Vcc=36V Vin=Vout=0V Vin=3.25V 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Input Clamp Voltage Vicl (V) 8 7.8 Input High Level Vih (V) 3.6 3.4 3.2 Iin=1mA 7.6 7.4 7.2 7 6.8 6.6 3 2.8 2.6 2.4 6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 2.2 2 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Input Low Level Vil (V) 2.6 2.4 2.2 Input Hysteresis Voltage Vhyst (V) 1.5 1.4 1.3 1.2 2 1.8 1.6 1.4 1.1 1 0.9 0.8 0.7 1.2 1 -50 -25 0 25 50 75 100 125 150 175 0.6 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) 10/18 1 VND600SP Overvoltage Shutdown Vov (V) 50 48 46 ILIM Vs Tcase Ilim (A) 80 70 Vcc=13V 60 44 42 40 38 36 20 34 32 30 -50 -25 0 25 50 75 100 125 150 175 10 0 -50 -25 0 25 50 75 100 125 150 175 50 40 30 Tc (C) Tc (C) Turn-on Voltage Slope dVout/dt(on) (V/ms) 750 700 650 600 550 500 450 400 350 300 250 -50 -25 0 25 50 75 100 125 150 175 Turn-off Voltage Slope dVout/dt(off) (V/ms) 500 450 Vcc=13V Rl=2.6Ohm 400 350 300 250 200 150 100 50 0 -50 Vcc=13V Rl=2.6Ohm -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) On State Resistance Vs Tcase Ron (mOhm) 100 90 80 70 60 50 40 30 On State Resistance Vs V CC Ron (mOhm) 80 70 Iout=5A Vcc=8V & 36V Iout=5A 60 50 40 30 20 Tc= 150C Tc= 25C 20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175 Tc= - 40C 10 0 5 10 15 20 25 30 35 40 Tc (C) Vcc (V) 11/18 1 VND600SP Maximum turn off current versus load inductance ILMAX (A) 100 A B C 10 1 0.01 0.1 1 L(mH) 10 100 A = Single Pulse at TJstart=150C B= Repetitive pulse at T Jstart=100C C= Repetitive Pulse at T Jstart=125C Conditions: VCC=13.5V Values are generated with R L=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization t 12/18 VND600SP PowerSO-10TM THERMAL DATA PowerSO-10TM PC Board Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2). Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 13/18 VND600SP PowerSO-10 Thermal Impedance Junction Ambient Single Pulse ZTH (C/W) 1000 100 Footprint 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Thermal fitting model of a double channel HSD in PowerSO-10 Pulse calculation formula Z TH = R TH + Z TH tp ( 1 - ) where = tp T Footprint 0.05 0.3 0.3 0.8 12 37 0.001 5.00E-03 0.02 0.3 0.75 3 6 Thermal Parameter Tj_1 Pd1 C1 C2 C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 Tj_2 R1 Pd2 R2 T_amb Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) 22 5 14/18 VND600SP PowerSO-10TM MECHANICAL DATA DIM. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*) (*) Muar only POA P013P mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232 inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8 B 0.10 A B 10 H E E2 E4 1 SEATING PLANE e 0.25 B DETAIL "A" A C D = D1 = = = SEATING PLANE h A F A1 A1 L DETAIL "A" P095A 15/18 VND600SP PowerSO-10TM SUGGESTED PAD LAYOUT 14.6 - 14.9 B TUBE SHIPMENT (no suffix) CASABLANCA MUAR C 10.8 - 11 6.30 A A C 0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 0.54 - 0.6 B 9.5 All dimensions are in mm. 1.27 Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8 10.4 16.4 4.9 17.2 TAPE AND REEL SHIPMENT (suffix "13TR") REEL DIMENSIONS Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 All dimensions are in mm. TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2 End All dimensions are in mm. Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components 16/18 1 VND600SP REVISION HISTORY Date Revision Description of Changes - Current and voltage convention update (page 2). - "Configuration diagram (top view) & suggested connections for unused and n.c. pins" insertion (page 2). Jul. 2004 1 - 6 cm2 Cu condition insertion in Thermal Data table (page 3). - VCC - OUTPUT DIODE section update (page 3). - Revision History table insertion (page 17). July 2004 2 - Disclaimers update (page 18). - Suggested connections for unused and n.c.pins" correction (page 2). 17/18 1 1 VND600SP Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - Printed in ITALY- All Rights Reserved. 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